Recently various electronic and electrical devices have come to be used in our societies. Under these circumstances the failure of the equipment gives a great impact on our social life. Printed circuit board（PCB） is an important component of the equipment and has various factors for failures include heat resistance wettability lift-off ion migration and power cycle failure solder breaks whiskers etc.
At the lecture solder joint endurance reliability is lectured based on the IEC standard
(IEC 62137-3: 2011 Electronics assembly technology-Part 3: Selection guidance of environmental and endurance test methods for solder joints) . The lecturer explains the reliability tests on the basic three viewpoints of "stress " "mechanism " and "acceleration coefficient."
As a result attendees can recognize that the quality and the reliability of electronic and electrical equipment should be fixed at the design stage and that it is important to build the equipment by firmly assuming the above-mentioned defects.