South Korean tech giant Samsung says it is the first to deliver next-generation high-bandwidth memory chips (HBM4) at scale.
The new HBM4 chips are designed for high-performance AI and computing workloads, delivering processing speeds of 11.7Gbps. Samsung says this exceeds the industry standard of 8Gbps by 46% and sets a “new benchmark for HBM4 performance”, with the chips capable of reaching up to 13Gbps.
Compared with its predecessor (HBM3E), the new chip offers a 1.22 times higher pin speed and the total memory bandwidth per stack has also increased 2.7 times, reaching a maximum of 3.3TBps.
Samsung said: “This achievement marks a first in the industry, securing an early leadership position in the HBM4 market.”
It puts Samsung alongside rivals SK Hynix and Micron Technology in the highly competitive market for next-generation memory chips, which are crucial for AI computing and data centre infrastructure.
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