A sensor electrode might be 1 millimetre in size, but the electronics ground plane could couple to objects 100 millimetres in size. There can also be extreme aspect ratios, e.g. a sensor with submillimetre gaps between printed circuit board (PCB) layers that extend for 10s of millimetres.

If a straightforward finite element method approach is taken for a 3D model, this can result in a large model that is slow to solve. Furthermore, the geometry is likely to have at least one moving part, and running the model over a range of positions can take an inordinate amount of time.

Register for this webinar to learn about:

• FEM and BEM methods for capacitive modelling with COMSOL Multiphysics
• Multi-scale simulation using equivalent circuit models
• Combining resistance and capacitance predictions under AC conditions
• Exploiting superposition and reciprocity to get sophisticated solutions from simple numerical models

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