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Testing if supplementary bonding is required.

MrJack96
I have read some bits stating we can measure between the two metallic parts in question and referring to the formula 


50/ia will give you the resistance needed to keep touch voltage to less than 50v 


my questions can we do the same test to determine if the part has a high enough resistance to not require bonding and what sort of figures we should look for?
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    Interesting stuff all this. So even in a broken pen situation the pipe work if metal will act as the electrode and should keep the installation at a similar potential. So say if an electrode connected to the MET of the same faulty installation and installed in the mud outside the electrode will be at near 240 but as we step a way the voltage should decrease?
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    Interesting stuff all this. So even in a broken pen situation the pipe work if metal will act as the electrode and should keep the installation at a similar potential. So say if an electrode connected to the MET of the same faulty installation and installed in the mud outside the electrode will be at near 240 but as we step a way the voltage should decrease?
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