but IMO I think bonding to the MET vs pipe bonding in every room would accomplish the same.
But in a fault situation where lots of current is flowing in the cpc but little current is flowing in the bonding conductor (just the 50mA or whatever flowing between two hands touching two things) then a bond to MET as opposed to a bond to the cpc near the fault will add the voltage drop along the cpc from MET to fault to the total touch voltage.
but IMO I think bonding to the MET vs pipe bonding in every room would accomplish the same.
But in a fault situation where lots of current is flowing in the cpc but little current is flowing in the bonding conductor (just the 50mA or whatever flowing between two hands touching two things) then a bond to MET as opposed to a bond to the cpc near the fault will add the voltage drop along the cpc from MET to fault to the total touch voltage.
