TN system - Max Zs Vs tripping time in the Presence of RCD protection

Hi, 
I am trying to confirm a point. 

as long as we meet the max disconnection time (let say 0.4s for a TN system) . for a small power circuit, 
Can we ignore the Max Zs requirement ? 

Example 
Small power  radial circuit ,20A RCBO 30mA , type A C curve, 
RCD trip time is 20ms 

but, max Zs is higher than it should be to Overload trip before 0.4s (lets say Max allowed  Zs is 1.09 but the measured is 1.40)

Can we override the 0.4s overload tripping requirement as its already being met with RCD protection of the RCBO ? i.e. as it trips at 20ms anyway so it meets the 0.4s requirement. 

Or is this a subjective matter? 

Thank you all in advance. 

Parents
  • Or, instead of RCDs, perhaps employ supplementary protective bonding.

    There also used to be an acceptable method of limiting the volt drop along the cpc to 50v as referenced to the connection of the main protective bonding thereby allowing extension of disconnection times to 5s. Perhaps that fell out of favour as MCBs (0.1s disconnection) replaced fuses in many circumstances.  

  • method of limiting the volt drop along the cpc to 50v as referenced to the connection of the main protective bonding

    This might sound very pedantic, and I mean no disrespect to  , but I feel it's important to correct a couple of points to avoid common misconceptions about supplementary protective bonding.

    Using this method (Regulations 415.2 and 419.3), the voltage is not actually limited to 50 V for every possible fault.

    It is limited to 50 V for currents up to and including the current which causes operation of the protective device (or, where multiple circuits share the same protective bonding, the largest of the protective devices) within 5 seconds.

    Example: I have a B32 circuit-breaker to BS EN 60898. The current guaranteed to cause disconnection time within 5 s is 160 A, therefore supplementary protective bonding at the limit specified in Regulation 415.2 is guaranteed to limit to 50 V for fault currents up to 160 A. For fault currents exceeding 160 A, the touch current will exceed 50 V, but the circuit will be disconnected within 5 s.

    Certainly, where supplementary protective equipotential bonding is applied in cases where a disconnection time < 5 s cannot be met (e.g. 0.4 s), but a higher disconnection time of 1 s or 5 s could be met, the touch-voltage is not guaranteed to be limited to 50 V.

    As Lyle points out, supplementary protective bonding is not really useful for B curve and C curve circuit-breakers, but is useful for fuses and D curve circuit-breakers.

    thereby allowing extension of disconnection times to 5s

    This is also not the case. There is no maximum disconnection time to be applied for protection against electric shock  where supplementary protective bonding is applied according to all of the requirements of BS 7671 (at least in "dry condition"). This is because, for currents below that causing 5 s disconnection time (i.e. leading to longer disconnection times), the touch-voltage does not exceed 50 V by virtue of the formula in Regulation 415.2.

    Disconnection within a certain time for protection against overcurrent (in this case fault current) may, however, still be necessary dependent on the characteristics of the overcurrent protective device for the circuit, and the cross-sectional areas and materials of the line conductor and cpc.

  • Actually my post was two part, the first line related to the provision of supplementary bonding but the second part related to what used to be called the "alternative method" which permitted disconnection times for final circuits that would otherwise require disconnection in 0.4s to be extended to a time not exceeding 5s. The method did not require supplementary bonding but, of course, the cpc impedance was derived from  the final circuit protective device disconnection times plotted against the touch voltage curve. 

    It was a feature of the 16th (413-02-12) and  the maximum resistance of the final circuit cpc was set out in Table 41C. Fuses were prevalent in final circuits back then.

    I wasn't recommending the method to be deployed, just mentioning it out of interest and, to some extent, as an acknowledgement of how we have become slaves to look-up tables rather than understanding what we are trying to achieve. 

  • Thanks  .

    The reason for my response was that I do hear it commonly put forward that BS 7671 doesn't permit touch voltages exceeding 50 V AC ... and I wanted to make sure no-one thought protective bonding (main or supplementary) actually achieved that in all cases.

    I suppose it's correct to say that BS 7671, for dry conditions, doesn't permit touch voltages exceeding 50 V to exist indefinitely for the faults it considers in the general rules.

  • As Lyle points out, supplementary protective bonding is not really useful for B curve and C curve circuit-breakers, but is useful for fuses and D curve circuit-breakers.

    My interest in electrickery post-dates 15th Edn, but at home there is supplementary bonding everywhere (including the kitchen sink), so was it the norm then to install it with MCBs?

    My concern is what to do with it when upgrading to RCD protection. Is it better to leave it in situ (which I have done) or remove it? If removal is an option, is there a risk from leaving some of it behind - there is so much of it that it would be difficult to be confident that it had all been removed?

Reply
  • As Lyle points out, supplementary protective bonding is not really useful for B curve and C curve circuit-breakers, but is useful for fuses and D curve circuit-breakers.

    My interest in electrickery post-dates 15th Edn, but at home there is supplementary bonding everywhere (including the kitchen sink), so was it the norm then to install it with MCBs?

    My concern is what to do with it when upgrading to RCD protection. Is it better to leave it in situ (which I have done) or remove it? If removal is an option, is there a risk from leaving some of it behind - there is so much of it that it would be difficult to be confident that it had all been removed?

Children
  • so was it the norm then to install it with MCBs

    It seems supplementary bonding in 15th Ed went well OTT. 

    My concern is what to do with it when upgrading to RCD protection. Is it better to leave it in situ (which I have done) or remove it?

    It depends on what else has changed ... for example plastic pipes etc.

    In general, there is probably little harm inside the premises, it's influence outside especially PME (e.g. garden tap)