When parts are not Exposed-conductive parts

BS7671

A mobile 19” racking enclosure containing a number of withdrawable LV class I items of equipment and other ELV measuring circuits contained within metal enclosures - the overall mobile racking unit is on wheels and floating from earth – however, the metal parts are only in contact with earth via the class I items located within it.

just considering protective systems and not EMC,  I would instinctively say that the entire mobile unit and its mechanical elements eg vertical struts, doors and outer enclosure form part of the ‘installation’ . All conductive parts which could become live under single fault of one of the class I items, so therfore all conductive  parts of the mobile unit ought to be bonded to its incoming supply earth terminal giving consideration to regulation 543.

But is it wrong to classify the racking system as exposed-conductive parts? Does the definition of exposed-conductive not extend to the racking it is bolted to?

Instead, does the racking qualify as extraneous-conductive parts which needs to comply with regulation 544 i.e. Bonded to the earthing terminal within the mobile enclosure with green/yellow not less than 6mm or half the CSA of the line conductors of the building’s incoming supply?

In summary, should I be bonding the racking parts via regulation 543, 544 or not bond at all?

Thanks

Parents
  • But is it wrong to classify the racking system as exposed-conductive parts?

    If all mains-powered products within the enclosure are self-contained Class I or Class II, and all wiring is insulated and sheathed, then, according to BS 7671, strictly, yes the metal parts of the "rack" are not exposed-conductive-parts. And usually, neither are they extraneous-conductive-parts.

    There are, however, very good reasons to provide supplementary protective bonding for safety purposes, including:

    • High protective conductor currents - helps reduce risks for anyone maintaining equipment in the rack.
    • Provides additional protection, which could be used as one of the mitigation measures if a risk assessment is used to omit RCDs for socket-outlets rated < 32 A (Regulation 411.3.3).
    • Could be considered a "restrictive access" location when someone is working in it, so if a fault to Earth occurs, bonding helps reduce risk of effects of shock.
    • If there is a lot of data cabling coming out of the rack, especially long runs, this picks up induced current which can also be a hazard. Screens of such cable may be bonded elsewhere, so the bonding in the rack helps to prevent touch-voltages between telecomms cable screens and local "earthy" things (this can, under certain circumstances, in very large premises, or with external cabling, be lethal to anyone working in the rack, if not handled correctly).

    However, as you pointed out, the main purpose of bonding is as an EMC mitigation measure, for which purpose low inductance bonding is required (and multiple bonds help reduce inductance). The requirements for bonding in telecomms racks are not in BS 7671, but in BS EN 50310 (IEC 30129 internationally). Section 444 of BS 7671 refers to BS EN 50310 for this purpose.

Reply
  • But is it wrong to classify the racking system as exposed-conductive parts?

    If all mains-powered products within the enclosure are self-contained Class I or Class II, and all wiring is insulated and sheathed, then, according to BS 7671, strictly, yes the metal parts of the "rack" are not exposed-conductive-parts. And usually, neither are they extraneous-conductive-parts.

    There are, however, very good reasons to provide supplementary protective bonding for safety purposes, including:

    • High protective conductor currents - helps reduce risks for anyone maintaining equipment in the rack.
    • Provides additional protection, which could be used as one of the mitigation measures if a risk assessment is used to omit RCDs for socket-outlets rated < 32 A (Regulation 411.3.3).
    • Could be considered a "restrictive access" location when someone is working in it, so if a fault to Earth occurs, bonding helps reduce risk of effects of shock.
    • If there is a lot of data cabling coming out of the rack, especially long runs, this picks up induced current which can also be a hazard. Screens of such cable may be bonded elsewhere, so the bonding in the rack helps to prevent touch-voltages between telecomms cable screens and local "earthy" things (this can, under certain circumstances, in very large premises, or with external cabling, be lethal to anyone working in the rack, if not handled correctly).

    However, as you pointed out, the main purpose of bonding is as an EMC mitigation measure, for which purpose low inductance bonding is required (and multiple bonds help reduce inductance). The requirements for bonding in telecomms racks are not in BS 7671, but in BS EN 50310 (IEC 30129 internationally). Section 444 of BS 7671 refers to BS EN 50310 for this purpose.

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