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Supplementary Bonding in High Zs Value Scenarios

AMK

Recently, I attended a webinar that addressed scenarios in which, due to elevated Zs values, a molded case circuit breaker (MCCB) was unable to achieve the disconnection times within the maximum permissible Zs values. The proposed resolution involved the implementation of additional protection through supplementary bonding exclusively at the intake position. However, one might consider whether this protective measure should extend to all equipment within the specified location, thereby necessitating supplementary bonding at the load end as well. What are your thoughts ?

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    I assume this all about the less than 50V touch voltage between any accessible parts as a protection measure where all conductive parts rise and fall together in voltage  and a voltage difference of less than 50 V is achieved between any parts by supplementary voltage?

    Then, in the above scenario, I’d assume that the Zs is sufficient for all down stream devices so didn’t need an alternative solution such as supplementary bonding? 


    Supplementary bonding would work for the load end too if needed.

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    I assume this all about the less than 50V touch voltage between any accessible parts as a protection measure where all conductive parts rise and fall together in voltage  and a voltage difference of less than 50 V is achieved between any parts by supplementary voltage?

    Then, in the above scenario, I’d assume that the Zs is sufficient for all down stream devices so didn’t need an alternative solution such as supplementary bonding? 


    Supplementary bonding would work for the load end too if needed.

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