Supplementary Bonding in High Zs Value Scenarios

Recently, I attended a webinar that addressed scenarios in which, due to elevated Zs values, a molded case circuit breaker (MCCB) was unable to achieve the disconnection times within the maximum permissible Zs values. The proposed resolution involved the implementation of additional protection through supplementary bonding exclusively at the intake position. However, one might consider whether this protective measure should extend to all equipment within the specified location, thereby necessitating supplementary bonding at the load end as well. What are your thoughts ?

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  • However, one might consider whether this protective measure should extend to all equipment within the specified location, thereby necessitating supplementary bonding at the load end as well.

    In a way there's two different questions there. Actually installing supplementary bonding, vs achieving what supplementary bonding requires. Typically you need to achieve R ≤ 50V / Ia between simultaneously accessible parts. So where Ze is high for instance (and R2 relatively low), you might achieve R ≤ 50V / Ia without actually having to add any supplementary bonding conductors as such - as the local c.p.s. will already achieve what's necessry. Or just supplementary bonding a few carefully chosen items (e.g. those with the longest c.p.c.s) might allow the requirements of supplementary bonding to be achieved over a wider area. Supplementary bonding at the intake presumably looks pretty similar to main bonding (other than the c.s.a.s involved) and normal c.p.c.s. A lot depends on the actual numbers for a particular situation.

       - Andy.

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  • However, one might consider whether this protective measure should extend to all equipment within the specified location, thereby necessitating supplementary bonding at the load end as well.

    In a way there's two different questions there. Actually installing supplementary bonding, vs achieving what supplementary bonding requires. Typically you need to achieve R ≤ 50V / Ia between simultaneously accessible parts. So where Ze is high for instance (and R2 relatively low), you might achieve R ≤ 50V / Ia without actually having to add any supplementary bonding conductors as such - as the local c.p.s. will already achieve what's necessry. Or just supplementary bonding a few carefully chosen items (e.g. those with the longest c.p.c.s) might allow the requirements of supplementary bonding to be achieved over a wider area. Supplementary bonding at the intake presumably looks pretty similar to main bonding (other than the c.s.a.s involved) and normal c.p.c.s. A lot depends on the actual numbers for a particular situation.

       - Andy.

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